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Post-Forming Extruded Profiles for Heat Transfer Applications Resulting in High Efficiency Cooling
Published Tuesday, April 14, 2009A majority of electronic devices are comprised of circuit boards with multiple heat generating chips of different height. Usually, machined high specification aluminum conduction plates or separate heat sinks are used for each chip. However, machined conduction plates are expensive and the use of separate heat sinks is complicated. Both have...
Categories: Materials, Engineering, Chemical, Devices
Keyword(s): extruded profiles heat transfer high efficiency cooling
Docket: PS-2007-058